Oregon Advanced Packaging Module Engineer - Laser

Intel

Hillsboro, ORFull-time$89,010 – $125,660 / yearly

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Job details

Pay

$89,010 – $125,660 / yearly

Job type

Full-time

Work setting

On-site

Location

Hillsboro, OR

Posted

Posted 7 days ago

Full job description

Intel's Oregon Advanced Packaging team in Hillsboro seeks a Module Engineer to own high-volume wafer packaging equipment and laser processes. Responsibilities include NPI, process optimization, inline metrology, excursion prevention, technology transfer to global sites, factory ramp coordination, continuous improvement, and supplier collaboration. Full-time on-site role.

Qualifications

STEM bachelor's with 1+ years hands-on semiconductor or process equipment experience, or a matching master's
Experience in laser processing or process development
Preferred: cleanroom, wafer-level packaging, or statistical tools like JMP and SQL

SemiconductorManufacturing

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