Advanced Packaging Dry Etch Module Development Engineer

Intel Foundry seeks a plasma etch process development engineer for advanced packaging technologies including 2.5D/3D integration and chiplet solutions.

• Develop and optimize plasma etch processes for advanced packaging applications
• Design experiments to characterize process windows and enhance etch performance
• Create and execute technology roadmaps aligned with future manufacturing requirements
• Partner with equipment suppliers on innovative process solutions
• Optimize production efficiency, yield, and manufacturing techniques
• Identify modifications to improve equipment performance and reduce costs

Minimum: Master's degree (4+ years experience) or PhD (2+ years) in Materials Science, Mechanical, Chemical, or Electrical Engineering, Chemistry, or Physics. Required expertise in semiconductor process development, Design of Experiments, statistical process control, and plasma etch equipment platforms.

Preferred: Wafer-level assembly or advanced packaging experience; demonstrated program leadership; technical expertise solving complex engineering challenges; strong cross-functional collaboration abilities.